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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Hardcover

Series: Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

Technology & Engineering

PREORDER - Expected ship date December 24, 2026

ISBN10: 1041216912
ISBN13: 9781041216919
Publisher: CRC Press
Published: Dec 24 2026
Pages: 304
Language: English

Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, analyze, and test in the fast-paced and low-cost small satellite environment. It also presents techniques to reduce the design and test cycles without compromising reliability. Further, the book serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for designing spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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Cepeda-Rizo, Juan

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Technology & Engineering