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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Paperback

Series: Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

Technology & Engineering

ISBN10: 1032160853
ISBN13: 9781032160856
Publisher: CRC Press
Published: Aug 26 2024
Pages: 290
Weight: 0.95
Height: 0.64 Width: 6.14 Depth: 9.21
Language: English

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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Cepeda-Rizo, Juan

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Technology & Engineering