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612-822-4611
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Hardcover

Series: Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

Technology & Engineering

ISBN10: 1032160810
ISBN13: 9781032160818
Publisher: Crc Pr Inc
Published: Dec 30 2021
Pages: 290
Weight: 1.33
Height: 0.69 Width: 6.14 Depth: 9.21
Language: English

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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