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Simulation and Reliability Assessment of Advanced Packaging

Simulation and Reliability Assessment of Advanced Packaging

Hardcover

Technology & Engineering

ISBN10: 3725809720
ISBN13: 9783725809721
Publisher: Mdpi AG
Published: Apr 30 2024
Pages: 296
Weight: 1.84
Height: 0.94 Width: 6.69 Depth: 9.61
Language: English

Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.

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Chiang, Kuo-Ning

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Technology & Engineering