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Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

Hardcover

Technology & EngineeringPhysics

ISBN10: 9819568900
ISBN13: 9789819568901
Publisher: Springer
Published: Jun 1 2026
Pages: 547
Weight: 2.14
Height: 1.25 Width: 6.14 Depth: 9.21
Language: English

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