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612-822-4611
Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Hardcover

Series: Emerging Technology in Advanced Packaging, Book 1

Technology & EngineeringGeneral Computers

ISBN10: 0792376765
ISBN13: 9780792376767
Publisher: Springer Nature
Published: Jan 31 2003
Pages: 347
Weight: 1.64
Height: 1.02 Width: 6.40 Depth: 9.52
Language: English

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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