• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Paperback

Series: Emerging Technology in Advanced Packaging, Book 1

Technology & EngineeringChemistry

ISBN10: 146134977X
ISBN13: 9781461349778
Publisher: Springer Nature
Published: Feb 23 2014
Pages: 347
Weight: 1.15
Height: 0.77 Width: 6.14 Depth: 9.21
Language: English

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

1 different editions

Also available

Also in

Technology & Engineering