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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys(r)

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys(r)

Madenci, Erdogan
Guven, Ibrahim
Kilic, Bahattin

Paperback

Series: The Springer International Engineering and Computer Science, Book 719

Technology & Engineering

ISBN10: 1461349893
ISBN13: 9781461349891
Publisher: Springer Nature
Published: Oct 14 2012
Pages: 185
Weight: 0.66
Height: 0.44 Width: 6.14 Depth: 9.21
Language: English
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(R) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS(R) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS(R) to perform solder joint reliability analysis.

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