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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys(r)

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys(r)

Hardcover

Series: The Springer International Engineering and Computer Science, Book 719

Technology & Engineering

ISBN10: 1402073305
ISBN13: 9781402073304
Publisher: Springer Nature
Published: Dec 31 2002
Pages: 185
Weight: 1.08
Height: 0.68 Width: 6.36 Depth: 9.48
Language: English
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(R) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS(R) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS(R) to perform solder joint reliability analysis.

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