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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Electronics Cooling: From the Chip to the Datacenter: Volume 62

Electronics Cooling: From the Chip to the Datacenter: Volume 62

Hardcover

Series: Advances in Heat Transfer, Book 62

Technology & EngineeringPhysics

PREORDER - Expected ship date November 1, 2026

ISBN10: 0443470847
ISBN13: 9780443470844
Publisher: Academic Press
Published: Nov 1 2026
Pages: 300
Language: English
Electronics Cooling: From the Chip to the Datacenter, Volume 62 provides a concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.

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