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Advances in Heat Transfer: Volume 60
Abraham, John Patrick
Gorman, John M.
Minkowycz, Wolodymyr J.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 47
Sparrow, Ephraim M.
Abraham, John Patrick
Gorman, John M.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 48
Sparrow, Ephraim M.
Abraham, John Patrick
Gorman, John M.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 51
Sparrow, Ephraim M.
Abraham, John Patrick
Gorman, John M.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 53
Sparrow, Ephraim M.
Abraham, John Patrick
Gorman, John M.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 54
Abraham, John Patrick
Gorham, John M.
Minkowycz, Wolodymyr J.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 59
Minkowycz, Wolodymyr J.
Abraham, John Patrick
Gorman, John M.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 52
Abraham, John Patrick
Gorman, John M.
Minkowycz, Wolodymyr J.
Hardcover
$325.50
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Advances in Heat Transfer: Volume 57
Abraham, John Patrick
Minkowycz, Wolodymyr J.
Gorman, John M.
Hardcover
$325.50
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$325.50
{"Id":29361840,"Title":"Electronics Cooling: From the Chip to the Datacenter: Volume 62","Authors":[],"ShortTitle":"Electronics Cooling: From the Chip to the Datacenter: Volume 62","Author":null,"Ean":"9780443470844","Isbn":"0443470847","Publisher":"Academic Press","IsOnShelf":false,"IsIngramAvailable":true,"IsBestSeller":false,"IsRecentArrival":false,"ConditionIds":[1],"GroupIds":[],"ContributorIds":[],"CategoryIds":[617,1098],"FormatId":1,"FamilyId":null,"SeriesId":44518,"LanguageId":56,"PriceMin":325.5,"PriceMax":325.5,"Desirability":0,"PublicationDate":"2026-11-01T00:00:00","Join":null}