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Electromigration in Thin Films and Electronic Devices: Materials and Reliability

Electromigration in Thin Films and Electronic Devices: Materials and Reliability

Paperback

Series: Woodhead Publishing Electronic and Optical Materials

Technology & Engineering

ISBN10: 0081016964
ISBN13: 9780081016961
Publisher: Woodhead Pub
Published: Sep 11 2011
Pages: 352
Weight: 1.09
Height: 0.74 Width: 6.14 Depth: 9.21
Language: English
Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in Thin Films and Electronic Devices provides an up-to-date review of key topics in this commercially important area.

Also from

Kim, Choong-Un

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Technology & Engineering