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612-822-4611
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

Hardcover

Technology & EngineeringGeneral Science

ISBN10: 1461492653
ISBN13: 9781461492658
Publisher: Springer
Published: Nov 6 2014
Pages: 253
Weight: 1.22
Height: 0.63 Width: 6.14 Depth: 9.21
Language: English

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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