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Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via

Hardcover

Technology & EngineeringGeneral ComputersNetworking

ISBN10: 940179037X
ISBN13: 9789401790376
Publisher: Springer Nature
Published: May 20 2014
Pages: 280
Weight: 1.29
Height: 0.69 Width: 6.14 Depth: 9.21
Language: English

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

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