• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via

Paperback

Technology & EngineeringGeneral ComputersNetworking

Currently unavailable to order

ISBN10: 940177949X
ISBN13: 9789401779494
Publisher: Springer
Published: Sep 27 2016
Pages: 280
Weight: 0.91
Height: 0.61 Width: 6.10 Depth: 9.25
Language: English

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

1 different editions

Also available

Also in

Technology & Engineering