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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Hardcover

Technology & EngineeringPhysics

ISBN10: 113862473X
ISBN13: 9781138624733
Publisher: Crc Pr Inc
Published: Jan 28 2021
Pages: 382
Weight: 1.63
Height: 1.00 Width: 6.10 Depth: 9.40
Language: English

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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