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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Paperback

Technology & EngineeringPhysics

ISBN10: 0367635887
ISBN13: 9780367635886
Publisher: CRC Press
Published: Oct 4 2024
Pages: 382
Weight: 1.25
Height: 0.84 Width: 6.14 Depth: 9.21
Language: English

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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Suhir, Ephraim

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Technology & Engineering