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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability

Paperback

Series: Woodhead Publishing Electronic and Optical Materials

Technology & Engineering

ISBN10: 0081020945
ISBN13: 9780081020944
Publisher: Woodhead Pub
Published: May 30 2018
Pages: 240
Weight: 0.72
Height: 0.51 Width: 6.00 Depth: 9.00
Language: English

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.

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