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Wafer Bonding: Applications and Technology

Wafer Bonding: Applications and Technology

Hardcover

Series: Springer Materials Science, Book 75

Technology & EngineeringPhysics

ISBN10: 3540210490
ISBN13: 9783540210498
Publisher: Springer
Published: May 14 2004
Pages: 504
Weight: 1.85
Height: 1.30 Width: 6.10 Depth: 9.20
Language: English

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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