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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging

Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging

Paperback

Series: Synthesis Lectures on Computational Electromagnetics

Technology & EngineeringPhysics

ISBN10: 3031005759
ISBN13: 9783031005756
Publisher: Springer Nature
Published: Dec 31 2007
Pages: 108
Weight: 0.48
Height: 0.25 Width: 7.50 Depth: 9.25
Language: English
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

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