Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Thermal Management for Opto-Electronics Packaging and Applications

Thermal Management for Opto-Electronics Packaging and Applications

Luo, Xiaobing
Hu, Run
Xie, Bin

Hardcover

Technology & Engineering

Currently unavailable to order

ISBN10: 1119179270
ISBN13: 9781119179276
Publisher: Wiley
Published: Aug 12 2024
Pages: 368
Height: 1.30 Width: 6.90 Depth: 9.90
Language: English
Thermal Management for Opto-electronics Packaging and Applications

A systematic guide to the theory, applications, and design of thermal management for LED packaging

In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design.

The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems.

The book also includes:

  • A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials
  • Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling
  • Practical discussions of thermally enhanced thermal interfacial materials (TIMs)
  • Complete treatments of hybrid thermal management in downhole devices

Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

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