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Semiconductor Packaging: Materials Interaction and Reliability
Paperback
ISBN13: 9781138075405
Publisher: Crc Pr Inc
Published: Apr 10 2017
Pages: 216
Weight: 0.69
Height: 0.46 Width: 6.14 Depth: 9.21
Language: English
This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
1 different editions
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Semiconductor Packaging: Materials Interaction and Reliability
Chen, Andrea
Lo, Randy Hsiao-Yu
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