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Solder Joint Reliability Assessment: Finite Element Simulation Methodology

Solder Joint Reliability Assessment: Finite Element Simulation Methodology

Paperback

Series: Advanced Structured Materials, Book 37

Technology & Engineering

ISBN10: 3319343017
ISBN13: 9783319343013
Publisher: Springer Nature
Published: Sep 3 2016
Pages: 174
Weight: 0.60
Height: 0.40 Width: 6.14 Depth: 9.21
Language: English
Introduction.- Overview of the Simulation Methodology.- Requirements for Finite Element Simulation.- Mechanics of Solder Materials.- Application I: Solder Joint Reflow Process.- Application II: Solder Joints under Temperature and Mechanical Cycles.- Damage Mechanics-based Models.- Application III: Board-level Drop Test with BGA Package.- Fatigue Fracture Process of Solder Joints.- Closure.

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