• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Silver Metallization: Stability and Reliability

Silver Metallization: Stability and Reliability

Paperback

Series: Engineering Materials and Processes

Technology & Engineering

ISBN10: 1849967059
ISBN13: 9781849967051
Publisher: Springer
Published: Mar 14 2012
Pages: 123
Weight: 0.44
Height: 0.29 Width: 6.14 Depth: 9.21
Language: English

With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability issues and the processing issues that have prevented silver from being used as an interconnect metal. Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. The authors provide details on a wide range of experimental, characterization, and analysis techniques. In addition, they discuss novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.

1 different editions

Also available

Also in

Technology & Engineering