• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Sic Power Module Design: Performance, Robustness and Reliability

Sic Power Module Design: Performance, Robustness and Reliability

Hardcover

Series: Energy Engineering

Technology & Engineering

ISBN10: 1785619071
ISBN13: 9781785619076
Publisher: Institution Of Engineering & T
Published: Feb 3 2022
Pages: 360
Weight: 1.60
Height: 0.90 Width: 6.30 Depth: 9.40
Language: English

High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging.

Also in

Technology & Engineering