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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Semiconductor Manufacturing for the AI Era Handbook: From Wafer Fabrication to Advanced Packaging for High-Performance Computing Systems

Semiconductor Manufacturing for the AI Era Handbook: From Wafer Fabrication to Advanced Packaging for High-Performance Computing Systems

Paperback

Technology & Engineering

Currently unavailable to order

ISBN13: 9798193441410
Publisher: Independently Published
Pages: 532
Weight: 2.69
Height: 1.07 Width: 8.50 Depth: 11.00
Language: English

From Wafer Fabrication to Advanced Packaging for High-Performance Computing Systems

What happens between semiconductor design and the finished AI chip?

Behind every AI accelerator is a highly coordinated manufacturing system involving materials, nanometer-scale patterns, contamination control, process variation, defects, yield, packaging, testing, and production efficiency.

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