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RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

Hardcover

Technology & Engineering

ISBN10: 1441909834
ISBN13: 9781441909831
Publisher: Springer Nature
Published: Nov 17 2009
Pages: 285
Weight: 1.33
Height: 0.69 Width: 6.14 Depth: 9.21
Language: English

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

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