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Reliability Technology for Integrated Circuit Packaging

Reliability Technology for Integrated Circuit Packaging

Hardcover

Technology & EngineeringPhysics

Currently unavailable to order

ISBN10: 981953884X
ISBN13: 9789819538843
Publisher: Springer
Published: Apr 21 2026
Pages: 510
Weight: 2.28
Height: 1.14 Width: 6.46 Depth: 9.26
Language: English
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of high-quality development a focus on reliability is essential to advancing manufacturing.

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