• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Proceedings of the International Conference on Machine Learning, Deep Learning and Computational Intelligence for Wireless Communication: Mdcwc 2023

Proceedings of the International Conference on Machine Learning, Deep Learning and Computational Intelligence for Wireless Communication: Mdcwc 2023

Hardcover

Series: Signals and Communication Technology

Technology & EngineeringGeneral Computers

ISBN10: 3031479416
ISBN13: 9783031479410
Publisher: Springer
Published: Apr 16 2024
Pages: 631
Weight: 2.40
Height: 1.38 Width: 6.14 Depth: 9.21
Language: English
This book is a collection of best selected research papers presented at the 2nd Conference on Machine Learning, Deep Learning and Computational Intelligence for Wireless Communication (MDCWC 2023) held during June 22-24th, 2023, at the National Institute of Technology Tiruchirappalli, India. The presented papers are grouped under the following topics (a) Machine learning, Deep learning and Computational intelligence algorithms (b) Wireless communication systems and (c) Mobile data applications. The topics include the latest research and results in the areas of network prediction, traffic classification, call detail record mining, mobile health care, mobile pattern recognition, natural language processing, automatic speech processing, mobility analysis, indoor localization, wireless sensor networks (WSN), energy minimization, routing, scheduling, resource allocation, multiple access, power control, malware detection, cyber security, flooding attacks detection, mobile apps sniffing, MIMO detection, signal detection in MIMO-OFDM, modulation recognition, channel estimation, MIMO nonlinear equalization, super-resolution channel and direction-of-arrival estimation. The book is a rich reference material for academia and industry.

Also from

Gopi, E. S.

Also in

Technology & Engineering