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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

Paperback

Series: Synthesis Lectures on Emerging Engineering Technologies

Technology & EngineeringGeneral Computers

ISBN10: 3031008995
ISBN13: 9783031008993
Publisher: Springer Nature
Published: Feb 16 2016
Pages: 72
Weight: 0.35
Height: 0.17 Width: 7.50 Depth: 9.25
Language: English
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

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