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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Paperback
Series: Woodhead Publishing Electronic and Optical Materials
ISBN13: 9780081025321
Publisher: Woodhead Publishing
Published: Nov 15 2019
Pages: 434
Weight: 1.28
Height: 0.89 Width: 6.00 Depth: 9.00
Language: English
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
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