• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Microelectronic Packaging

Microelectronic Packaging

Hardcover

Series: New Trends in Electrochemical Technology, Book 3

Technology & Engineering

ISBN10: 041531190X
ISBN13: 9780415311908
Publisher: CRC Press
Published: Dec 1 2004
Pages: 564
Weight: 2.01
Height: 1.20 Width: 6.46 Depth: 9.42
Language: English
This book explores the impact of electrochemical technologies on microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book considers chip wiring as a key aspect of microelectronic packaging and focuses on electrochemical processing as an enabler of advanced chip metallization. The book begins by outlining electrochemical processing, then discusses chip metallization topics. It explores chip-package interconnect technologies; analyzes packages, boards, and connectors; and concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.

Also in

Technology & Engineering