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Microelectronic Interconnections and Assembly

Microelectronic Interconnections and Assembly

Hardcover

Series: NATO Science, Book 54

Technology & EngineeringGeneral Computers

ISBN10: 0792351398
ISBN13: 9780792351399
Publisher: Springer Nature
Published: Aug 31 1998
Pages: 316
Weight: 1.36
Height: 0.75 Width: 6.14 Depth: 9.21
Language: English
Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.

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