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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Mems Packaging

Mems Packaging

Hardcover

Series: Wspc Advanced Integration and Packaging, Book 5

Technology & Engineering

ISBN10: 9813229357
ISBN13: 9789813229358
Publisher: World Scientific Publishing Company
Published: Jan 13 2018
Pages: 364
Weight: 1.44
Height: 0.81 Width: 6.00 Depth: 9.00
Language: English

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.

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Technology & Engineering