Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
612-822-4611

  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612

Oehrlein, G. S.
Maex, K.
Joo, Y. -C

Paperback

Series: Mrs Proceedings

Technology & Engineering

ISBN10: 110741315X
ISBN13: 9781107413153
Publisher: Cambridge
Published: Jun 5 2014
Pages: 614
Weight: 1.78
Height: 1.24 Width: 6.00 Depth: 9.00
Language: English
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

Also in

Technology & Engineering

View All