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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Materials for Information Technology: Devices, Interconnects and Packaging

Materials for Information Technology: Devices, Interconnects and Packaging

Zschech, Ehrenfried
Whelan, Caroline
Mikolajick, Thomas

Paperback

Series: Engineering Materials and Processes

Technology & Engineering

ISBN10: 1849969671
ISBN13: 9781849969673
Publisher: Springer Nature
Published: Oct 22 2010
Pages: 508
Weight: 1.62
Height: 1.07 Width: 6.14 Depth: 9.21
Language: English
Recent Advances in Thin-film Deposition.- Molecular-beam Deposition of High-k Gate Dielectrics for Advanced CMOS.- LEPECVD - A Production Technique for SiGe MOSFETs and MODFETs.- Thin-film Engineering by Atomic-layer Deposition for Ultra-scaled and Novel Devices.- Atomic-layer Deposited Barrier and Seed Layers for Interconnects.- Copper CVD for Conformal Ultrathin-film Deposition.- Pushing PVD to the Limits - Recent Advances.- Surface Engineering Using Self-assembled Monolayers: Model Substrates for Atomic-layer Deposition.- Selective Airgaps: Towards a Scalable Low-k Solution.- Silicides - Recent Advances and Prospects.- TEM Characterization of Strained Silicon.- Material Aspects of Non-Volatile Memories.- An Introduction to Nonvolatile Memory Technology.- Floating-dot Memory Transistors on SOI Substrate.- Ion-beam Synthesis of Nanocrystals for Multidot Memory Structures.- Scaling of Ferroelectric-based Memory Concepts.- Device Concepts with Magnetic Tunnel Junctions.- Phase-change Memories.- Amorphous-to-fcc Transition in GeSbTe Alloys.- Organic Nonvolatile Memories.- Materials for Interconnects.- Interconnect Technology - Today, Recent Advances and a Look into the Future.- Dielectric and Scaling Effects on Electromigration for Cu Interconnects.- Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction.- Stress Modeling for Copper Interconnect Structures.- Conductivity Enhancement in Metallization Structures of Regular Grains.- Advanced Barriers for Copper Interconnects.- Synthesis and Characterization of Compounds Obtained by Crosslinking of Polymethylhydrosiloxane by Aromatic Rings.- Revealing the Porous Structure of Low-k Materials Through Solvent Diffusion.- Carbon Nanotube Via Technologies for Future LSI Interconnects.- Nickel Nanowires Obtained by Template Synthesis.- Materials for Assembly/Packaging.- The Importance of Polymers in Wafer-Level Packaging.- Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge.- The Role of Au/Sn Solder in Packaging.- Packaging Materials: Organic-Inorganic Hybrids for Millimetre-Wave Optoelectronics.- Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding.- Advanced Materials Characterization.- Challenges to Advanced Materials Characterization for ULSI Applications.- Advanced Material Characterization by TOFSIMS in Microelectronic.- Electronic Properties of the Interface Formed by Pr2O3 Growth on Si(001), Si(111) and SiC(0001) Surfaces.- Materials Characterization by Ellipsometry.- Thermal Desorption Spectrometry as a Method of Analysis for Advanced Interconnect Materials.- Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section.- X-ray Reflectivity Characterisation of Thin-Film and Multilayer Structures.

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