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612-822-4611
An Introduction to Bonding for Electronic Facilities for Professional Engineers

An Introduction to Bonding for Electronic Facilities for Professional Engineers

Paperback

Series: Electric Power Generation and Distribution

Technology & Engineering

ISBN13: 9798402324855
Publisher: Independently Published
Published: Jan 14 2022
Pages: 56
Weight: 0.45
Height: 0.15 Width: 8.50 Depth: 11.00
Language: English
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.

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Guyer, J. Paul

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Technology & Engineering