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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
International Symposium on Electronic Materials and Packaging (Emap2000): November 30-December 2, 2000, Hong Kong

International Symposium on Electronic Materials and Packaging (Emap2000): November 30-December 2, 2000, Hong Kong

Hardcover

Technology & Engineering

Currently unavailable to order

ISBN10: 0780366549
ISBN13: 9780780366541
Publisher: Inst Of Electrical & Electroni
Published: Jan 1 2000
Pages: 478
Language: English
Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.

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Technology & Engineering