Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
High Performance Design Automation for Multi-Chip Modules and Packages

High Performance Design Automation for Multi-Chip Modules and Packages

Cho, Jun Dong
Franzon, Paul D.

Hardcover

Series: Selected Topics in Electronics and Systems, Book 5

Technology & EngineeringGeneral Computers

ISBN10: 9810223072
ISBN13: 9789810223076
Publisher: World Scientific Publishing Company
Published: Jun 12 1996
Pages: 264
Weight: 2.99
Height: 0.80 Width: 6.55 Depth: 9.93
Language: English
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

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