Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
612-822-4611

  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
High Speed Digital Design Handbook: Signal Integrity, Transmission Lines, PCB Layout, and High-Frequency Techniques for Practicing Engineers

High Speed Digital Design Handbook: Signal Integrity, Transmission Lines, PCB Layout, and High-Frequency Techniques for Practicing Engineers

Downing, Jared C.

Paperback

Technology & Engineering

Currently unavailable to order

ISBN13: 9798186716525
Publisher: Independently Published
Pages: 372
Weight: 1.90
Height: 0.77 Width: 8.50 Depth: 11.00
Language: English
For Every Engineer Losing Sleep Over Signal Integrity

Your PCB traces are transmission lines. Your power planes resonate. Your eye diagram is closing. And your datasheet does not tell you why or what to do about it.

At 1 GHz, every wire on your board stops behaving like a wire. At 10 GHz and beyond, the rules you learned in university fail completely. This is the handbook that closes that gap the one between what school taught and what your job actually demands.

What Is Inside

14 chapters. 350+ pages. Every concept derived from first principles, then applied with worked numbers:

  • Transmission line theory - why traces ring, reflect, and radiate, derived from Maxwell's equations
  • PCB stackup design - controlled impedance formulas for microstrip, stripline, and differential pairs
  • Signal degradation - ISI, jitter, eye diagrams, bathtub curves, and BER prediction
  • Crosstalk - NEXT, FEXT, the 3W rule, and guard trace design with quantified isolation
  • Differential signaling - LVDS, CML, SerDes architecture, mode conversion, and skew matching
  • Power delivery networks - target impedance, decoupling hierarchy, plane resonance, and SSN
  • Measurement techniques - TDR, VNA, oscilloscope, BERT, and compliance testing
  • Memory interfaces - DDR4, DDR5, LPDDR5 fly-by routing, write leveling, and timing margins
  • Serial interfaces - PCIe Gen 1-7, USB4, 400G/800G Ethernet, SATA, SAS equalization
  • EMC and EMI - radiated emissions, FCC/CISPR limits, shielding, filtering, and SSCG
  • Via and connector design - stub resonance, back-drilling, BGA fanout, and backplane budgeting
  • SI simulation - SPICE, IBIS-AMI, 3D EM solvers, pre/post-layout correlation
  • Thermal effects - copper resistivity vs. temperature, hot-corner IL derating, PDN cold-start
  • Emerging interfaces - PCIe Gen 6/7, UCIe die-to-die, 1.6T Ethernet, co-packaged optics

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