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Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Hardcover

Technology & EngineeringGeneral Science

ISBN10: 9811088837
ISBN13: 9789811088834
Publisher: Springer Nature
Published: Apr 13 2018
Pages: 303
Weight: 1.39
Height: 0.75 Width: 6.14 Depth: 9.21
Language: English
Patent Issues of Fan-out Wafer-Level Packaging.- Flip Chip Technology vs. FOWLP.- Fan-In Wafer-Level Packaging vs. FOWLP.- Embedded Chip Packaging.- FOWLP: Chip-First and Die Face-Down.- FOWLP: Chip-First and Die Face-Up.- FOWLP: Chip-Last or RDL-First.- FOWLP: PoP with FOWLP.- Fan-Out Panel-Level Packaging (FOPLP).- 3D Integration.- Heterogeneous Integration.

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Technology & Engineering