• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications

Paperback

Series: Materials and Processes for Electronic Applications

Technology & Engineering

ISBN10: 0128119780
ISBN13: 9780128119785
Publisher: William Andrew
Published: Oct 11 2018
Pages: 508
Weight: 1.49
Height: 1.03 Width: 6.00 Depth: 9.00
Language: English

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.

Also in

Technology & Engineering