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Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties

Hardcover

Series: Electronic Packaging

Technology & Engineering

ISBN10: 0849396255
ISBN13: 9780849396250
Publisher: CRC Press
Published: Dec 18 1998
Pages: 120
Weight: 0.78
Height: 0.49 Width: 6.35 Depth: 9.50
Language: English
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The book also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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Pecht, Michael

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Technology & Engineering