Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Lim, Sung Kyu

Hardcover

Technology & EngineeringGeneral Computers

ISBN10: 1441995412
ISBN13: 9781441995414
Publisher: Springer Nature
Published: Nov 25 2012
Pages: 560
Weight: 1.95
Height: 1.40 Width: 6.40 Depth: 9.20
Language: English
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous manufacturing-ready GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

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