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Cooling of Microelectronic and Nanoelectronic Equipment

Cooling of Microelectronic and Nanoelectronic Equipment

Hardcover

Series: Wspc Advanced Integration and Packaging, Book 3

Technology & Engineering

ISBN10: 9814579785
ISBN13: 9789814579780
Publisher: World Scientific Publishing Company
Published: Sep 6 2014
Pages: 472
Weight: 1.76
Height: 1.20 Width: 6.10 Depth: 9.10
Language: English

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.

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