Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Chemical-Mechanical Polishing 2000 Fundamentals and Materials Issues: Volume 613

Chemical-Mechanical Polishing 2000 Fundamentals and Materials Issues: Volume 613

Singh, Rajiv K.
Bajaj, Rajeev
Moinpour, Mansour

Paperback

Series: Mrs Proceedings

Technology & Engineering

ISBN10: 1107413141
ISBN13: 9781107413146
Publisher: Cambridge University Press
Published: Jun 5 2014
Pages: 176
Weight: 0.54
Height: 0.38 Width: 6.00 Depth: 9.00
Language: English
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.

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