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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Carbon Nanotubes for Interconnects: Process, Design and Applications

Carbon Nanotubes for Interconnects: Process, Design and Applications

Todri-Sanial, Aida
Dijon, Jean
Maffucci, Antonio

Hardcover

Technology & EngineeringGeneral Computers

ISBN10: 3319297449
ISBN13: 9783319297446
Publisher: Springer Nature
Published: Jul 18 2016
Pages: 333
Weight: 1.46
Height: 0.81 Width: 6.14 Depth: 9.21
Language: English
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

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