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Area Array Packaging Processes

Area Array Packaging Processes

Paperback

Technology & Engineering

ISBN10: 0071738010
ISBN13: 9780071738019
Publisher: McGraw-Hill
Published: Oct 23 2003
Pages: 272
Weight: 1.04
Height: 0.57 Width: 7.50 Depth: 9.25
Language: English
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

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Technology & Engineering