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Area Array Package Design

Area Array Package Design

Paperback

Technology & Engineering

ISBN10: 0071737731
ISBN13: 9780071737739
Publisher: McGraw-Hill
Published: Oct 24 2003
Pages: 220
Weight: 0.85
Height: 0.46 Width: 7.50 Depth: 9.25
Language: English
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

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Technology & Engineering