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Advanced Flip Chip Packaging

Advanced Flip Chip Packaging

Hardcover

Technology & Engineering

ISBN10: 1441957677
ISBN13: 9781441957672
Publisher: Springer Nature
Published: Mar 21 2013
Pages: 560
Weight: 2.60
Height: 1.30 Width: 6.10 Depth: 9.40
Language: English

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

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Technology & Engineering